Plate-making method and plate-making apparatus for stencil printing and stencil printing machine

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7278351
APP PUB NO 20050016395A1
SERIAL NO

10485460

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Abstract

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A plate-making method for stencil printing in which heat-sensitive stencil plate material for stencil printing consisting of a thermoplastic resin film is melted by heating of a thermal head to perforate an ink permeable openings includes forming recesses on one side of the film. An opposite side to the one side of the film is heated so that the heated portion is melted for communication with the recesses to form ink permeable openings.

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Patent Owner(s)

Patent OwnerAddress
DUPLO SEIKO CORPORATIONKINOKAWA-SHI WAKAYAMA 649-6551

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okagaito, Yasunari Wakayama, JP 3 3
Sugiyama, Yoshihide Wakayama, JP 24 266

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