Method of manufacturing silver flake

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050016328A1
SERIAL NO

10885687

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Abstract

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A method of manufacturing silver flake, whereby characteristic of a plating film of providing uniform thickness is utilized, and material selected for use as a substrate is that which is easily removed and broken. First, a layer of silver metal is plated on a surface of the substrate, whereafter such test specimen is crushed and the substrate removed, or first remove the substrate material and thereafter crush, and that which remains is silver powder of extremely uniform thickness. The silver flake thus acquired is provided with superior thermal and electrical conductivity in a specific direction.

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Patent Owner(s)

Patent OwnerAddress
FAR EAST COLLEGE49 CHUNG-HWA RD HSIN-SHIH TAINAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Jenn-Shing Yungkang City, TW 14 56

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