Method of inhibiting corrosion of copper plated or metallized surfaces and circuitry during semiconductor manufacturing processes
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United States of America Patent
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Issued Date -
Jan 13, 2005
app pub date -
Jul 11, 2003
filing date -
Jul 11, 2003
priority date (Note) -
Abandoned
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Abstract
An treatment bath for use in the manufacture of copper plated or metallized semiconductor devices and a method of inhibiting corrosion of copper plated or metallized surfaces and circuitry in the semiconductor devices immersed in an aqueous fluid in a treatment bath comprising adding to the aqueous fluid an effective corrosion inhibiting amount of one or more aromatic triazole corrosion inhibitors; fluorometrically monitoring the concentration of aromatic triazole corrosion inhibitors in the aqueous fluid; and adding additional aromatic triazole corrosion inhibitor to the aqueous fluid to maintain an effective corrosion inhibiting concentration of the aromatic triazole corrosion inhibitor in the aqueous fluid.
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