Digital image capturing module assembly and method of fabricating the same

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United States of America Patent

APP PUB NO 20050007484A1
SERIAL NO

10618434

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Abstract

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A digital image capturing module assembly and method of fabricating the same is proposed, which is used for the assembly of a digital image capturing module from a photosensitive printed circuit board and a lens holder. The proposed module assembly is characterized by the use of aligning posts on the lens holder to help align and secure the photosensitive printed circuit board in position on the lens holder as well as by the use of a washer to help provide a sealed light-impenetrable effect at the junction between the photosensitive printed circuit board and the lens holder so that no sidelight can pass therethrough to the inside of the lens holder. This feature allows the assembly process to be more simplified and less time-consuming to implement than prior art, which can help increase the yield of the assembly of digital image capturing module.

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Patent Owner(s)

Patent OwnerAddress
INVENTEC MICRO-ELECTRONICS CORPORATIONINVENTEC BUILDNG 66 HOU-KANG ST SHIH-LIN DISTRICT TAIPEI R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shi, Jia Shanghai, CN 47 608
Tan, Kah-Ong Shanghai, CN 13 76

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