Family

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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
NIKON CORPORATION	15-3 KONAN 2-CHOME MINATO-KU TOKYO 1086290 ?1086290
NIKON TECHNOLOGIES INC	3-25 FUTABA 1-CHOME SHINAGAWA-KU TOKYO 142-0043

International Classification(s)

• C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....

• 2004 Application Filing Year
• C23F Class
• 407 Applications Filed
• 111 Patents Issued To-Date
• 27.28 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Ito, Akinori	Matsudo-shi, JP	50	447
# of filed Patents : 50 Total Citations : 447
Komatsu, Isao	Tokyo, JP	16	35
# of filed Patents : 16 Total Citations : 35
Sugaya, Isao	Kawasaki-shi, JP	53	266
# of filed Patents : 53 Total Citations : 266

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Patent Citation Ranking

• 2 Citation Count
• C23F Class

• 4.95 % this patent is cited more than
• 20 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2005/0000,943

Processing apparatus, method for fabrication of semiconductor device by using the processing apparatus, and semiconductor device fabricated by this method

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Abstract

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The processing apparatus in accordance with the present invention comprises an object holding unit for holding a processing object, a tool holding unit for holding a tool for processing the processing object, and a relative movement mechanism for causing relative movement of the processing object held in the object holding unit and the tool held in the tool holding unit, while maintaining contact therebetween. The object holding unit and/or the tool holding unit are composed of a plurality of support plates of almost flat shape having elastic property which are arranged in a row.

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Description

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Claims

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