Copper alloy
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United States of America Patent
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Issued Date -
Dec 30, 2004
app pub date -
Apr 23, 2004
filing date -
Apr 30, 2003
priority date (Note) -
Abandoned
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Abstract
A copper alloy having superior thermal conductivity comparable to that of conventional materials, can be produced at low cost. An oxygen free copper, a base material of a Cu--B alloy were melted in vacuo by a casting method, B and at least one element selected from Mg, Ni, Co, Al, Si, Fe, Zr, and Mn are added into the molten metal wherein the content of each element or the alloy of Ni--B, Fe--B, Cu--Mg, and so forth becoming the predetermined content. This alloy is cast into an ingot of 12 mm square, heated at 600 to 900.degree. C. for 1 hour, and the cast was rolled to be 3 mm by hot rolling. After these steps, heat treatment at 600 to 900.degree. C. was provided and processed into predetermined shape.
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