Matching device and plasma processing apparatus

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United States of America Patent

APP PUB NO 20040261717A1
SERIAL NO

10491212

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A machining device includes first branched waveguides (71A-71C) and second branched waveguides (73A-73C) connected perpendicularly to an axial (Z) direction of a cylindrical waveguide (14) and having one end which opens in the cylindrical waveguide (14) and the other end which is electrically short-circuited. The first branched waveguides (71A-71C) are arranged at a predetermined interval in an axial (z) direction of the cylindrical waveguide (14). The second branched waveguides (73A-73C) are arranged in positions which make an angle of 90.degree. with positions of the first branched waveguides (71A-71C) when viewed from the axis (Z) of the cylindrical waveguide (14), and arranged at a predetermined interval in the axial (Z) direction of the cylindrical waveguide (14). With this arrangement, it is possible to accurately and easily control the impedance matching between the supply side and load side of the cylindrical waveguide (14).

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO
NIHON KOSHUHA CO LTD1119 NAKAYAMA-CHO MIDORI-KU YOKOHAMA-SHI KANAGAWA-KEN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishii, Nobuo Hyogo, JP 83 3487
Shinohara, Kibatsu Kanagawa, JP 36 692

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