Grip for ultrasonic scaler
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 23, 2004
app pub date -
Aug 20, 2004
filing date -
Aug 1, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Importance

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Abstract
A grip for an ultrasonic scaler insert includes a soft grip portion externally attached to a rigid body having front, rear and central portions. The soft grip is attached to the rigid body either by adhesive or ovennolding, and includes a plurality of elongated ridges along an exterior surface of the soft grip. The elongated ridges are spaced apart on the exterior surface in a manner directed to follow finger placement on the grip, so that the grip may be easily manipulated. The material making up the soft grip helps to reduce vibrations transmitted to the user during operation of the ultrasonic scaler.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
COLTENE/WHALEDENT INC | 235 ASCOT PARKWAY CUYAHOGA FALLS OH 44223-3701 |
International Classification(s)

- 2004 Application Filing Year
- A61C Class
- 456 Applications Filed
- 237 Patents Issued To-Date
- 51.98 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Mayer, Stanley | Middletown, NY | 12 | 94 |
# of filed Patents : 12 Total Citations : 94 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 11 Citation Count
- A61C Class
- 41.56 % this patent is cited more than
- 21 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
- a) a first nanostructured or finely structured layer (21) of a first material is deposited on the surface of the substrate (20) by means of a thermal spraying method via a liquid route; the surface of the substrate (20) not having been subject, prior to the deposition of the first nanostructured or finely structured layer (21), to any preparation or activation treatment other than an optional cleaning treatment;b) a second microstructured layer (22) of a second material is deposited on the first nanostructured or finely structured layer (21) by means of a thermal spraying method.

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