Mounting mechanism for high performance dielectric resonator circuits
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United States of America Patent
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Issued Date -
Dec 23, 2004
app pub date -
May 7, 2003
filing date -
May 7, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention is a method and apparatus for dissipating heat in a dielectric resonator circuit in which resonators are mounted to an enclosure by highly thermally and electrically conductive supports, such as metal rods, that pass through the longitudinal through hole in the center of the resonator. The supports preferably are attached within the through holes by a highly thermally conductive, but dielectric sleeve positioned between the support and the resonator. The rod or support has a diameter selected to minimize any reduction in quality factor, Q, for the circuit. Alternately, the support can be a highly thermally conductive dielectric and the inner wall of the through hole can be metalized.
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