Device and method for monitoring and regulating a process solution
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United States of America Patent
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Issued Date -
Dec 16, 2004
app pub date -
Apr 16, 2004
filing date -
Mar 5, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed are a device and a method for continuously monitoring and regulating a process solution or the concentration of additives in a process solution, which influence the surface tension, particularly surfactants, in permanently operating industrial cleaning, coating, and rinsing installations, based on measuring the surface tension according to the bubble pressure method. Units detecting the surface tension or the concentration of a process additive in a process solution, processing and controlling a predefined internal program flow of the device, continuously monitoring the quality of a process solution, and triggering an external unit influencing the process are coordinated by means of an intelligent computer system which independently extracts and processes process data, uses the data for modifying the program flow thereof, exchanges the data with an external process control system, and influences the process.
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