HEAT-SENSITIVE STENCIL PLATE MATERIAL FOR STENCIL PRINTING, METHOD AND APPARATUS FOR PRODUCING THE STENCIL PLATE MATERIAL AND STENCIL PRINTING MACHINE

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United States of America Patent

APP PUB NO 20040253391A1
SERIAL NO

10485458

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Abstract

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The present invention provides a plate material made only of thermoplastic resin film by use of a polyester film so that an ink-penetrating opening can be thermally perforated without increasing the output of a thermal head. The film is a heat sensitive stencil plate material 12 for stencil printing having a predetermined thickness, and is composed of an extended PET film or a extended low melting temperature film produced by copolymerizing PET and PBT. Many minute recesses 14 are formed on one side of the film by templating. The templating can be carried out at a working pressure of 10.sup.4.times.10.sup.2(m-t)/(m-g) Pa or more, when the working temperature is t.degree. C.; the melting point of the film is m(.degree. C.) and the glass transition point of the film is g(.degree. C.).

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Patent Owner(s)

Patent OwnerAddress
DUPLO SEIKO CORPORATIONKINOKAWA-SHI WAKAYAMA 649-6551

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okagaito, Yasunari Wakayama, JP 3 3
Sugiyama, Yoshihide Wakayama, JP 24 266

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