Trench filling methods
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 9, 2004
app pub date -
Jun 3, 2004
filing date -
Jun 4, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention consists in methods or processes for filling high aspect ratio recesses, such as shallow trench isolation structure wherein a flowable layer is deposited in the recess to reduce the aspect ratio of the recess and none of the flowable material is in the plane of the mouth of the recess, and the recess is subsequently filled by other material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully