Electronic pckage with conductive pad capable of withstanding significant loads and information handling system utilizing same
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United States of America Patent
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app pub date -
Jun 16, 2004
filing date -
Mar 20, 2003
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Abandoned
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Abstract
A circuitized substrate which utilizes an underlying conductive layer coupled to a pad on the substrate to assure a reinforced pad which will not be damaged or removed from the substrate when subjected to a significant load. Two or more pads can be similarly provided and coupled to the conductive layer, e.g., the layer being a common (ground) layer. An information handling system (e.g., a personal computer) utilizing the substrate is also provided.
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