Electropolishing assembly and methods for electropolishing conductive layers
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United States of America Patent
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Issued Date -
Dec 2, 2004
app pub date -
May 10, 2004
filing date -
Nov 13, 2001
priority date (Note) -
Abandoned
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Abstract
In one aspect of the present invention, an exemplary apparatus and method are provided for electropolishing a conductive film on a wafer. An apparatus includes a wafer chuck for holding a wafer, an actuator for rotating the wafer chuck, and a nozzle configured to electropolish the wafer. The apparatus may further include a conductive ring or a shroud. A method of electropolishing a conductive film on a wafer includes rotating a wafer chuck with sufficient speed such that electrolyte fluid incident upon the wafer flows on the surface of the wafer towards the edge of the wafer.
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