Uniform impedance printed circuit board
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United States of America Patent
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N/A
Issued Date -
Dec 2, 2004
app pub date -
May 28, 2003
filing date -
May 28, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A technique for ameliorating the reflections on traces on printed circuit boards is taught that seeks to present a uniform--or more uniform--impedance profile to a trace as it traverses the printed circuit board. In the illustrative embodiments, this is accomplished by adding grounded vias to the printed circuit board in places and densities outside the connector footprints so that the linear density and proximity of the added ground vias along each trace is similar or identical to the density and proximity of the ground vias along the trace within a connector footprint.
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