Multi-point polymer encapsulated micro-thermocouple
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United States of America Patent
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Issued Date -
Dec 2, 2004
app pub date -
Mar 16, 2004
filing date -
Mar 21, 2002
priority date (Note) -
Abandoned
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Abstract
A thermocouple produced by removing insulation from a distal end of each of at least first and second thermocouple conductors, forming a thermocouple junction at the distal ends of the at least first and second thermocouple conductors, placing the thermocouple junction into the heat shrinkable polymer material by sliding a second end of the tube of heat shrinkable polymer material over the thermocouple junction and sealing the thermocouple junction by heating and melting the polymer material.
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