Partial encapsulation of stents
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United States of America Patent
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N/A
Issued Date -
Nov 25, 2004
app pub date -
Jun 21, 2004
filing date -
Feb 2, 1999
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An implantable medical device having a first and second ePTFE tube with a support layer positioned therebetween. The support layer may include a plurality of ring stents or may be a single stent structure. Slits may be cut into the first and/or second ePTFE tube to provide flexibility to the implantable medical device. These slits may be cut in any direction (longitudinally, circumferentially, diagonally, etc.) and may be oriented with respect to the support layer such that a desired degree of flexibility may be attained. The first and second ePTFE tubes may be bonded together through openings in the support layer to produce a partially encapsulated stent device.
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