Lamination and delamination technique for thin film processing
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United States of America Patent
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Issued Date -
Nov 25, 2004
app pub date -
May 23, 2003
filing date -
May 23, 2003
priority date (Note) -
Abandoned
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Abstract
This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer whose thermal decomposition temperature changes drastically upon photoexposure. These materials, prior to photoexposure, can withstand temperatures in the range of approximately 200.degree. C. to 300.degree. C. without decomposition, yet decompose at around 100.degree. C. with photoexposure. The releasable adhesion layer can be used in a thermal transfer element, sandwiching a donor substrate and a transfer layer having a plurality of multicomponent transfer units. In the absence of light, the releasable adhesion layer can sustain high temperature processing of these multicomponent transfer units. By photoexposing according to a pattern, the photoexposed multicomponent transfer units can be selectively released at a low temperature to transfer to a receptor.
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