Digital image capturing module assembly and method of fabricating the same
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United States of America Patent
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N/A
Issued Date -
Nov 18, 2004
app pub date -
Jul 10, 2003
filing date -
May 13, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A digital image capturing module assembly and method of fabricating the same is proposed, which is designed for the assembly of a digital image capturing module from a photosensitive printed circuit board and a lens holder. The proposed module assembly is characterized by the provision of a shouldered portion and a grooved portion in the lens holder's inner wall around the focusing plane of the lens holder wherein an adhesive layer is coated in the grooved portion to adhere the photosensitive printed circuit board to the lens holder. This feature allows the junction between the photosensitive printed circuit board and the lens holder to have a sealed light-impenetrable quality, so that the captured image by the digital image capturing module would be substantially free of sidelight effect. Moreover, it allows the finished product of digital image capturing module to be more compact in size than prior art.
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