Stacked cores and the heat dissipation method for the same
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United States of America Patent
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Issued Date -
Nov 18, 2004
app pub date -
Apr 22, 2003
filing date -
Apr 22, 2003
priority date (Note) -
Abandoned
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Abstract
A configuration of stacked cores and the heat dissipation for the stacked cores utilize a plurality of spacers provided between adjacent cores, whereby a gap is accordingly formed by the spacers to expedite the heat dissipation. Since a gap is defined between the adjacent cores, the heat dissipation surfaces for adjacent cores are increased and the generated heat is quickly removed from the stacked cores in a short time.
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