Method and apparatus for bonding a cover to a substrate using high frequency microwaves

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United States of America Patent

PATENT NO 7261794
APP PUB NO 20040226648A1
SERIAL NO

10439712

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Abstract

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A method for adhesively bonding a covering to a support using a dry heat-sensitive adhesive to produce an assembly for an automotive interior. The method positions the layers to form an assembly of material layers in tooling that concentrates microwave radiation energy conversion to the adhesive layer above its melting temperature. The method for fabricating an assembly in accordance with the subject invention, particularly when the tooling is transparent to the radiation, controls the radiation reflection, which is generated at a frequency exceeding 30 GHz.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL AUTOMOTIVE COMPONENTS GROUP LLCC/O WL ROSS & CO LLC 600 LEXINGTON AVENUE 19TH FLOOR NEW YORK NY 10022

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gupte, Sunil K Livonia, MI 7 64
Parrish, Kenneth R Detroit, MI 16 112

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