Highly conductive resin compositions
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United States of America Patent
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Issued Date -
Nov 11, 2004
app pub date -
May 5, 2003
filing date -
May 5, 2003
priority date (Note) -
Abandoned
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Abstract
The present invention relates to resin compositions, particularly those having a high degree of conductivity. In particular, the present invention relates to highly conductive die attach compositions useful for attaching semiconductor devices to carrier substrates. The invention further provides methods of preparing such compositions, methods of applying such compositions to substrate surfaces, and packages and assemblies prepared therewith for connecting microelectronic circuitry.
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