Semiconductor light emitting devices including embedded curent injection layers
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United States of America Patent
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Issued Date -
Nov 11, 2004
app pub date -
May 7, 2004
filing date -
May 8, 2003
priority date (Note) -
Abandoned
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Abstract
Electrically conductive, embedded current injection layers are provided in combination with cladding layers to provided improved current conduction to the active light-emitting regions of semiconductor light-emitting devices. The embedded electrical contact layers are used to inject current directly into the active region of semiconductor light-emitting devices. Free-carrier loss within the cladding layers is reduced, and power efficiency is improved by eliminating voltage drops associated with current transport through the cladding layers. Moreover, use of the embedded current injection layers eliminates the need to transport current through the cladding layers thereby allowing the use of a wider range of materials for the cladding layers. The present current injection layers may be embedded in various semiconductor light-emitting devices, i.e., both edge- and surface-emitting devices, such as semiconductor diode lasers, interband cascade lasers, light-emitting diodes and vertical cavity surface-emitting lasers.
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