INTEGRATED CIRCUIT PACKAGE WITH FLAT METAL BUMP AND MANUFACTURING METHOD THEREFOR
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United States of America Patent
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N/A
Issued Date -
Nov 11, 2004
app pub date -
Sep 19, 2002
filing date -
Sep 19, 2002
priority date (Note) -
Abandoned
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Abstract
A flat gold bump, and manufacturing method therefor, is provided. An under bump metallurgy is formed on the contact pad in and around the opening. A bump pad is formed over the under bump metallurgy and a flat gold bump is formed on and over the bump pad.
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