Abrasive slurry having high dispersion stability and manufacturing method for a substrate
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United States of America Patent
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Issued Date -
Nov 11, 2004
app pub date -
Feb 18, 2004
filing date -
May 9, 2003
priority date (Note) -
Abandoned
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Abstract
To provide an abrasive slurry having high dispersion stability, including: abrasive fine particles made of one or more kinds of oxides; colloidal fine particles made of colloidal oxide with an average particle size smaller than an average particle size of the abrasive fine particles; and a dispersion medium in which the abrasive fine particles and the colloidal fine particles are dispersed, and a manufacturing method for a substrate as an inorganic substrate, including polishing the substrate using the abrasive slurry. An abrasive slurry according to the present invention keeps high dispersion stability for a long time and shows a satisfactory redispersion property, which can eliminate a problem about precipitation/aggregation as much as possible and can be used as a dispersant-free abrasive containing absolutely no organic dispersant. In particular, by using the abrasive slurry, it is possible to manufacture a substrate such as a silicon substrate used in a semiconductor manufacturing process or an aluminum substrate used in an electrostatic chuck manufacturing process through CMP with industrial advantage.
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