Preformed EMI/RFI shielding compositions in shaped form
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United States of America Patent
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N/A
Issued Date -
Nov 4, 2004
app pub date -
Apr 30, 2004
filing date -
Apr 30, 2003
priority date (Note) -
Abandoned
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Abstract
Electrically conductive preformed compositions comprising sulfur-containing polymers in shaped form and the use of preformed compositions in shaped form to seal apertures are disclosed. The preformed compositions can be used to seal an aperture having EMI/RFI shielding effectiveness.
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