Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
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United States of America Patent
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Issued Date -
Nov 4, 2004
app pub date -
Jan 6, 2004
filing date -
Jul 9, 2001
priority date (Note) -
Abandoned
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Abstract
Ammonia-free cleaning compositions for cleaning microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous dielectrics, low-k or high-k dielectrics and copper metallization. Cleaning compositions for stripping photoresists, cleaning residues from plasma generated organic, organometallic and inorganic compounds, and cleaning residues from planarization processes. The cleaning composition contain one or more non-ammonium producing strong base containing non-nucleophilic, positively charged counter ions and one or more corrosion inhibiting solvent compounds, said corrosion inhibiting solvent compound having at least two sites capable of complexing with metals.
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