Semiconductor packaging structure
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United States of America Patent
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N/A
Issued Date -
Nov 4, 2004
app pub date -
Aug 26, 2003
filing date -
Nov 14, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A packaging structure for a semiconductor device includes a substrate surface-mountable on a mounting surface of a circuit board. The substrate has a first side facing away from the mounting surface and a second side being on the same side of the structure as the mounting surface. A recess is formed in the second side of the substrate. A semiconductor die having a first side and a second side is mounted in the recess, with the first side of the semiconductor die facing away from the mounting surface and a portion of the first side of the semiconductor die bonded to the substrate within the recess.
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