Method for manufacturing light emitting diode utilizing transparent substrate and metal bonding technology and structure thereof
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United States of America Patent
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Issued Date -
Oct 21, 2004
app pub date -
Apr 14, 2004
filing date -
Apr 16, 2003
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing the light emitting diode utilizing the transparent substrate and the metal bonding technology is provided. The method includes steps of providing a growing substrate, forming a semiconductor structure on the growing substrate, forming a metal bonding layer on the semiconductor structure, bonding a transparent substrate to the semiconductor structure via the metal bonding layer, removing the growing substrate, and forming a first electrode and a second electrode on the semiconductor structure and the transparent substrate respectively.
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