Method for forming a wafer level chip scale package, and package formed thereby
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United States of America Patent
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app pub date -
Apr 16, 2004
filing date -
Apr 26, 2001
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Abandoned
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Abstract
A method for fabricating a chip scale package is described. The method utilizes wafer level processes to obtain a chip level package. The method particularly avoids the use of mechanical grinding by the novel use of molding, extruding, and etching technology.
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