Polypropylene-based resin composition for a metallized film, film using the same to be subject to metallizing and metallized film using the same
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United States of America Patent
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Issued Date -
Sep 16, 2004
app pub date -
Jul 30, 2003
filing date -
Jul 30, 2002
priority date (Note) -
Abandoned
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Abstract
A polypropylene-based resin composition for metallized films, comprising (A) 100 parts by weight of a propylene random copolymer having an MFR.sub.A of 1 to 30 g/10 minutes, PI of 2.4 to 4, solubles contained at 20.degree. C. or lower at 1.5% by weight or less and solubles contained at 40.degree. C. or lower at 4.0% by weight or less, (B) 0.01 to 6 parts by weight of a polyethylene resin having a density of 0.945 to 0.980 g/cm.sup.3 and MI.sub.B of 1 to 1000 g/10 minutes, (C) 0.01 to 0.7 parts by weight of an antiblocking agent having an average particle size of 1.0 to 5.0 .mu.m and pore volume of 1.7 mL/g or less, (D) 0.01 to 0.5 parts by weight of an antioxidant having a molecular weight of 500 or more and (E) 0.005 to 0.5 parts by weight of a hydrotalcite-based compound, and the metallized film of the same composition, excellent in processability, stiffness, heat-sealing property, resistance to blocking and surface scratching, containing a limited quantity of solubles, excellent in adhesion properties of the metallizing film to the base film, printability and lamination characteristics of the metallized surface.
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