Device for bonding substrates
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United States of America Patent
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N/A
Issued Date -
Sep 9, 2004
app pub date -
Jan 20, 2004
filing date -
May 10, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In order to ensure synchronous rotation of two substrates during bonding in a simple and economical manner, the invention provides a device for bonding two substrates having one inner hole to a substrate disc. Said device comprises a first rotating holding device (55) to hold the first substrate, a second rotating holding device (84) to hold the second substrate (84) and a drive mechanism for rotating one of the holding devices, wherein the second holding device is coupled to a rotating shaft (72) in a rotationally fixed manner (72), said shaft having a centering part (20) engaging in the inner hole of at least the second substrate while the second holding device can be moved along the axis of rotation of the shaft and thereupon.
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