Lasable bond-ply materials for high density printed wiring boards
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United States of America Patent
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app pub date -
Nov 17, 2003
filing date -
Apr 4, 2001
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Abstract
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
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