Unleaded solder
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 2, 2004
app pub date -
Dec 12, 2003
filing date -
Jun 12, 2001
priority date (Note) -
Abandoned
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Abstract
The invention concerns a lead-free solder comprising a bismuth-based alloy. The lead-free solder has a proportion of at least 80 percent by weight of bismuth and a solidus temperature of at least 260.degree. C.
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