Electrostatic clamping of thin wafers in plasma processing vacuum chamber
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Aug 12, 2004
app pub date -
Jan 21, 2004
filing date -
Feb 7, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Apparatus and methods of processing a substrate having a thickness of 250 microns or less are described. Each use a dark space shield between the plasma in a process chamber and the periphery of the substrate to prevent the presence of plasma between the shield and the periphery whilst allowing processing of the substrate. In every case an electrostatic chuck is utilised.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully