Device for bonding substrates
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United States of America Patent
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N/A
Issued Date -
Aug 5, 2004
app pub date -
Feb 2, 2004
filing date -
May 10, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In order to ensure simultaneous rotation of two substrates during boding in a simple and economical manner, the invention provides a device for bonding two substrates having one inner hole to a substrate disc. Said device comprises a first holding device (55) to hold the first substrate, a centering pin that is connected in a rotationally fixed manner to the first holding device (84) and that can be inserted into the inner hole of at least the first substrate, in addition to a drive mechanism for rotating the centering pin (1) and the first holding device. The invention is characterized by a driver (20) that can be engaged with the centering pin (1) and a second holding device to hold the second substrate, which is connected to the driver (20) in a rotationally fixed manner.
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