Epoxy resin compositions, methods of preparing, and articles made therefrom
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United States of America Patent
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N/A
Issued Date -
Jul 29, 2004
app pub date -
Jan 23, 2003
filing date -
Jan 23, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Epoxy resin compositions including a boron atom containing compound, and preferably a multiple boron atom containing compound, are disclosed. The resin compositions exhibit enhanced properties such as cure time and glass transition temperature 'Tg' and are particular suited to be utilized in the manufacture of composites, especially prepregs used for the manufacture of composite structures.
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