Composition and associated method for oxide chemical mechanical planarization
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United States of America Patent
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Issued Date -
Jul 29, 2004
app pub date -
Dec 8, 2003
filing date -
Dec 9, 2002
priority date (Note) -
Abandoned
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Abstract
A composition and associated method for oxide chemical mechanical planarization (or other polishing) are described. The composition and associated method afford high oxide removal rates while they simultaneously afford low levels of defectivity, haze, and scratching during polishing (e.g., CMP). The composition comprises an abrasive, a fluoride salt, and an acetylenic alcohol.
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