Solder composition substantially free of lead
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United States of America Patent
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app pub date -
Feb 27, 2003
filing date -
Jan 22, 2003
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Abstract
This invention provides solder that is substantially free of lead that minimizes corrosion from occurring in the soldering equipment such as the tip of the soldering iron and soldering dipping tank. Without substantial, if any, amount of lead in the solder, the solder does not expose lead into the environment. The solder composition also includes element(s) that extend the life of the soldering tip or other equipments associated with soldering. The solder composition may include Sn (tin) along with Co (cobalt) and Fe (iron). Tin may make up the most of the content in the solder composition. The two elements cobalt and iron substantially inhibit tin from corroding the iron, thereby substantially preventing the soldering iron tip and dipping solder tank from corroding. The composition of the solder may also include Ag (silver) to improve the mechanical strength and wettability of the solder. Alternatively, the composition may include Ni (nickel) to improve the wettability of the solder as well, along with other elements.
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