Method of manufacturing a semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 22, 2004
app pub date -
Dec 19, 2003
filing date -
Dec 25, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention is to prevent electrostatic breakdown or drying failure in a step of cleaning a backside of a semiconductor wafer, thereby improving reliability of a semiconductor device. A semiconductor wafer is rotated in a state where a backside of the semiconductor wafer is directed upward. A rinsing liquid is supplied to the backside of the semiconductor wafer from a nozzle to clean the same by a brush. During that time, a rinsing liquid is supplied to a surface of the semiconductor wafer from a nozzle disposed below that. At that time, a direction of spray of the rising liquid from the nozzle is set to be orthogonal to the surface of the semiconductor wafer, and a liquid flow of the rinsing liquid sprayed from the nozzle is applied to a position away from the center of the surface of the semiconductor wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully