Method and apparatus for separating composite substrate

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United States of America Patent

APP PUB NO 20040137697A1
SERIAL NO

10339570

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Abstract

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A method and an apparatus for separating a composite substrate 1 by which the composite substrate 1 is warped to cause a crack and grow it in a separation region 6, a silicon substrate 2 constituting the composite substrate 1 is separated along the separation region 6, and the silicon substrate 2 is separated from the composite substrate 1 with ease.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO MITSUBISHI SILICON CORPORATION2-1 SHIBAURA 1-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tomita, Shinichi Saga, JP 22 235

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  • 6 Citation Count
  • H01L Class
  • 1.54 % this patent is cited more than
  • 21 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges43114369735018712260482631176601 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650700750800850900950100010501100115012001250

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