Contacting microchips by means of pressure
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United States of America Patent
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N/A
Issued Date -
Jul 15, 2004
app pub date -
Feb 10, 2004
filing date -
Feb 13, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for contacting microchips is provided, in which an adhesive is deposited such on a side of a substrate, on which a conductor trace is located, and/or on a side of a microchip, on which at least one bump is located, such that a liquid layer of adhesive is formed on the same. Subsequent to adjusting the microchips such that the at least one bump is located above a predetermined site on the conductor trace of the substrate, a press contact between the at least one bump and the predetermined site is produced by exerting a pressure between the microchip and the substrate, with the adhesive being subsequently cured.
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