Abrasive-free chemical mechanical polishing composition and polishing process containing same
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United States of America Patent
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Issued Date -
Jul 15, 2004
app pub date -
Oct 21, 2003
filing date -
Jul 25, 1996
priority date (Note) -
Abandoned
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Abstract
The present invention relates generally to a chemical mechanical polishing composition for polishing a metal, a metal oxide, and/or a metal nitride layer of a substrate, which composition is substantially free of abrasive particles and comprises: a hydroxylamine derivative; a corrosion inhibitor; and water, wherein water comprises the majority of the composition. The composition may optionally include, or alternately be substantially free from, one or more of the following: hydroxylamine, acid and/or base to adjust pH, two carbon atom linkage alkanolamine compounds, quaternary ammonium salts, chelating agents, organic solvents, non-hydroxyl-containing amine compounds, surfactants, additional oxidizing agents, and non-abrasive additives. A process for chemically mechanically polishing a substrate using such a polishing composition is also provided herein.
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