Resin composition and thermo/photosensitive composition
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United States of America Patent
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Aug 4, 2009
Grant Date -
Jul 8, 2004
app pub date -
Aug 12, 2003
filing date -
Aug 16, 2002
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Abstract
The present invention provides a resin composition that includes (A) a polymer compound that has, on a side chain of a main chain polymer, through a linkage group containing a hydrogen-bonding group and a ring structure, a terminal ethylenic unsaturated bond, and is soluble or swelling in water or an alkali aqueous solution, and (B) a compound that generates radicals when exposed to light or heat. The invention further provides a thermo/photosensitive composition that includes (A′) a polymer compound that has a non-acidic hydrogen-bonding group on a side chain and is soluble or swelling in water or an alkali aqueous solution, and (B′) a compound that generates radicals when exposed to light or heat.
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