Structure for heat dissipation
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United States of America Patent
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Issued Date -
Jul 8, 2004
app pub date -
Nov 12, 2003
filing date -
Nov 12, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipating structure includes a composite having a thermal expansion coefficient between 30.degree. C. and 250 .degree. C. in a range from 2 to 13.10.sup.-6 K.sup.-1, a volume mass below 3000 kg.multidot.m.sup.-3, and a conductivity equal to or greater than 113 W.multidot.m.sup.-1.multidot.K.sup.-1. The composite is formed by a matrix which is made of a metal, polymer, or resin, in combination with a reinforcement component. The reinforcement component contains microfibers at a volume proportion in a range from 5 to 90% and nanofibers at a volume proportion from 1 to 60%, with the composite obtained through infiltration of the reinforcement component by the metal in liquid state or the polymer and resin in liquid or uncured state. Applied onto the composite is a surface layer having entirely or at least partially a metallic character.
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