Method and apparatus for mounting electronic components and program therefor

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20040130863A1
SERIAL NO

10669552

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is an electronic component mounting apparatus, which is provided with a board transfer device for transferring circuit boards and a pair of component supply devices arranged with the board transfer device therebetween for supplying electronic components on the boards. Of the component supply devices, one of them is designated as main component supply device for primarily supplying the electronic components on the boards, and the other is designated as secondary component supply device for supplying the electronic components as long as the component supply from the main component supplying device is discontinued. The electronic component mounting apparatus performs a switching control so that the electronic components are supplied from the main component supply device during the ordinary mounting operation, but from the secondary component supply device when th component supply from the main component supplying device is discontinued.

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Patent Owner(s)

Patent OwnerAddress
FUJI MACHINE MFG CO LTDAICHI AICHI

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shimizu, Kouji Chiryu-shi, JP 44 326
Terui, Seiichi Chiryu-shi, JP 10 123

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