Blister board article, blister pack system, and processes of making
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United States of America Patent
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N/A
Issued Date -
Jun 24, 2004
app pub date -
Dec 18, 2002
filing date -
Dec 18, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A blister-board article is provided that includes a substrate and a unique adhesive material layer that is above the substrate. The blister-board article is useful as a base for an information layer and a blister packaging material that is bonded to the unique adhesive material layer through the information layer. A blister-pack system is also disclosed in which an object is between a blister layer and the adhesive material layer. A process is also disclosed including the formation of a sizing layer upon the substrate. Optionally, a base coat layer is formed, either on a starch sizing layer or directly on the substrate.
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