Measuring the surface properties of polishing pads using ultrasonic reflectance
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United States of America Patent
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Issued Date -
Jun 10, 2004
app pub date -
Dec 3, 2003
filing date -
Oct 24, 2001
priority date (Note) -
Abandoned
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Abstract
The present invention provides a system and method for measuring the surface properties of polishing pads using non-contact ultrasonic reflectance. An ultrasonic probe is located over the polishing surface and configured to both transmit an ultrasonic signal to the polishing surface and receive a modified ultrasonic signal from the polishing surface without contacting the polishing surface. A subsystem coupled to the ultrasonic probe is configured to determine a surface property of the polishing pad from the modified signal.
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