Leadless semiconductor packaging structure with inverted flip chip and methods of manufacture
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United States of America Patent
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Issued Date -
Jun 10, 2004
app pub date -
Dec 9, 2002
filing date -
Dec 9, 2002
priority date (Note) -
Abandoned
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Abstract
A semiconductor chip packaging structure is described. The structure comprising of a semiconductor chip interconnected to a recessed lead frame and the resultant assembly encapsulated in a molding compound. The final product is a reverse mounted semiconductor chip in a leadless quad flat pack configuration. A second embodiment allows for the semiconductor chip backside to be exposed for thermal enhancements. Manufacturing methods are also described for the two embodiments disclosed.
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