Electroplating anode assembly
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United States of America Patent
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N/A
Issued Date -
Jun 10, 2004
app pub date -
Apr 7, 2003
filing date -
Dec 6, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electroplating anode assembly and method for electroplating the plating area of a work-piece. The assembly includes a conductive element and a helical insulating coil. The conductive element can either be a straight conductive wire or a helically coiled conductive wire. The insulating coil is substantially equal in length to the conductive element and positioned around the conductive element for preventing the conductive element from contacting the plating area of the work-piece. The insulating coil extends continuously along the length of the entire electroplating portion of the conductive element. The anode assembly can be used to achieve uniform and adequate electroplating surfaces within recessed and enclosed plating areas of work-pieces that are conventionally difficult to electroplate due to its ability to be readily manipulated into various shapes. Further, anode assembly can be readily repositioned during the course of electroplating to further reduce the instance of localized areas of thick/thin deposition.
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